Guest Encapsulation in Metal–Organic Frameworks for Photonics
Photonic functional materials have received mounting attention because of their employment in luminescent sensing, display, white-light-emission (WLE), data storage, bioimaging,
Temperature
Coencapsulation
Photonics
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Integrated circuit–microfluidic biosensors for blood-based disease
Integrated circuit (IC)-integrated microfluidic biosensors have revolutionized blood-based diagnostics by merging precise electronic sensing with on-chip sample manipulation. Over the past decade,
Low-temperature strain-free encapsulation for perovskite sol
" Low-temperature strain-free encapsulation for perovskite solar cells and modules passing multifaceted accelerated ageing tests," Nature Communications, Nature, vol. 15 (1), pages 1-15, December.
Low-temperature strain-free encapsulation for perovskite solar cells
Major stability assessments have been recently achieved but reliable accelerated ageing tests on beyond small-area cells are still poor. Here, we report an industrial encapsulation process based on
Encapsulation of Perovskite Solar Cells with Thin
New and innovative strategies have been introduced to overcome the challenges associated with the deposition of a pinhole-free, low-temperature
Photonic chip-based low-noise microwave oscillator
We leverage advances in integrated photonics to generate low-noise microwaves with an optical frequency division architecture that can be low power and chip integrated.
Surface encapsulation for low-loss silicon photonics
A short dry thermal oxidation followed by a long high-temperature ${mathrm{N}}_{2}$ anneal is found to be most effective at long-term encapsulation and reduction of interface absorption.
Low‐Temperature Sputtered Ultralow‐Loss Silicon Nitride for Hybrid
We believe that our low-temperature sputtered Si 3 N 4 is a significant step toward the hybrid monolithic integration of silicon nitride with silicon photonics for applications in telecom
Damp heat–stable perovskite solar cells with tailored
Tailored two-dimensional perovskite passivation layers enable efficient, damp-heat stable inverted perovskite solar cells.
Characterization of a New Low Temperature Encapsulation Method
In this work, the performance of a new ethylene-vinyl acetate-based low temperature encapsulation method, conceived to protect perovskite samples from UV irradiation in ambient
Testing Considerations for High-Density Co
At Quantifi Photonics, we recognize the urgency of supplying high-channel, high-density test equipment that will help make the proliferation of co-packaged optical devices a reality.
Co-packaged optics (CPO): status, challenges, and
Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically
Validation of the COSINE-100U NaI(Tl) Encapsulation for Low-Temperature
Upon confirming stable optical performance, the temperature was lowered to −33 C. During approximately 150 days of continuous operation at low temperature, we observed no degradation in
Novel strain-free, low-temperature encapsulation approach for
The encapsulation process was carried out at low temperature (between 60 °C and 90 °C) using an industrial laminator.
Validation of the COSINE-100U NaI(Tl) Encapsulation for Low
During approximately 150 days of continuous operation at low temperature, we observed no degradation in performance. These results demonstrate the chemical and mechanical robustness of the
Review of encapsulation materials for AlGaN-based deep
Yosuke Nagasawa, Akira Hirano, "Review of encapsulation materials for AlGaN-based deep-ultraviolet light-emitting diodes," Photonics Res. 7, B55 (2019)
Low-temperature strain-free encapsulation for perovskite solar cells
Here, we report an industrial encapsulation process based on the lamination of highly viscoelastic semi-solid/highly viscous liquid adhesive atop the perovskite solar cells and modules. Our...
Materials, methods and strategies for encapsulation of perovskite solar
Lamination is an important step in the process of encapsulation, this means the melting point of the encapsulant should be low (typical lamination temperature for commercially available
Interlayer engineering in metal halide perovskite photovoltaics
This Review discusses recent advances in interlayer engineering for perovskite solar cells, highlighting promising materials and architectures that could improve the stability and efficiency of
Low-temperature remote plasma enhanced atomic layer
How to cite this article: Chen, Z. et al. Low-temperature remote plasma enhanced atomic layer deposition of ZrO 2 /zircone nanolaminate film for efficient
Low‐Temperature Sputtered Ultralow‐Loss Silicon
We believe that our low-temperature sputtered Si 3 N 4 is a significant step toward the hybrid monolithic integration of silicon nitride with
Surface Encapsulation forLow-Loss Silicon Photonics
Encapsulation layers are explored for passivating the surfaces of silicon to reduce optical ab-sorption in the 1500-nm wavelength band. Surface-sensitive test structures consisting of microdisk resonators
Influence of encapsulation process temperature on the performance of
We evaluate the influence of the encapsulation process temperature between 120 °C and 160 °C on the performance of mini modules. The UV-absorbing encapsulation material is
Low-Temperature Strain-Free Encapsulation For Perovskite Solar
The article discusses a novel low-temperature strain-free encapsulation method for perovskite solar cells (PSCs) and modules, which enhances their stability and efficiency during accelerated aging tests.